交联剂是半导体行业的重要产品之一。交联剂与聚合物结合,将聚合物链粘合在一起,从而生产出对存储和逻辑芯片制造至关重要的光刻胶。
贺利氏电子化学材料长期以来一直以高纯度的乙二醇脲为基础生产用于半导体光刻胶的交联剂。我们开发的工艺使我们能够在任何生产规模下控制甲醛和二氯甲烷污染。
贺利氏的低金属污染、无二氯甲烷和无甲醛产品定义了半导体工业的新标准。各种化学改性已将升华趋势降至极低水平。我们将金属杂质降低到 10 ppb 以下,这对生产越来越小的存储和逻辑芯片至关重要。
4 个搜索结果
Name | Technology | Product Type | Description | |
---|---|---|---|---|
PL Phenyl Methyl | Multi-layer photo-lithographic application | Crosslinkers | White powder m.p. 136–138°C Available methylene chloride-free (MCF) and UP | |
PL-1174 | Multi-layer photo-lithographic application | Crosslinkers | White crystalline powder m.p. 107–113°C Available methylene chloride-free (MCF) and UP | |
PLPM | Multi-layer photo-lithographic application | Crosslinkers | White powder m.p. 87–89°C Available methylene chloride-free (MCF) and UP | |
TBGU | Multi-layer photo-lithographic application | Crosslinkers | Colorless liquid Available methylene chloride-free (MCF) and UP |